Reflow soldering process technology and precautions
The far-infrared reflow soldering used in the 1980s has the characteristics of fast heating, energy saving, and smooth operation. However, due to the different materials and colors of printed boards and various components, there are significant differences in their radiation heat absorption rates, resulting in uneven temperatures in different components and parts of the circuit, namely local temperature differences. For example, the black plastic packaging of integrated circuits may overheat due to high radiation absorption, while the soldering area - the silver white lead - may experience false soldering due to low temperature. In addition, areas on the printed circuit board where thermal radiation is blocked, such as soldering pins in shaded areas of large (high) components or small components, can cause poor soldering due to insufficient heating.
2024-11-20