Here are some more energy-efficient methods when using a wave soldering machine
Reasonably set preheating temperature and time
• Accurately set the preheating temperature based on factors such as the material, size, and component layout of the circuit board being soldered. Generally speaking, for common FR-4 circuit boards, the preheating temperature can be set between 100-120 ℃. This can avoid excessive heat consumption during subsequent welding processes due to high or low temperatures. For example, if the preheating temperature is too low, more heat is needed during the wave soldering stage to melt and wet the solder joint.
• Meanwhile, controlling the preheating time is also crucial. Appropriately extending the preheating time and allowing the circuit board to slowly heat up can fully activate the flux, reduce defects during the soldering process, and also help lower the temperature required for wave soldering, thereby saving energy. For example, for complex multi-layer circuit boards, the preheating time can be set to 80-120 seconds.
Choose an efficient preheating method
Infrared preheating is one of the commonly used methods. It has the characteristics of fast heating speed and high efficiency. By arranging the position and quantity of infrared lamps reasonably, the circuit board can be heated more evenly, reducing the energy waste caused by local overheating. Moreover, infrared preheating can accurately transfer heat to the circuit board, reducing heat loss in the surrounding environment compared to traditional hot air preheating.
Combination preheating (such as infrared and hot air combination) is also widely used. This method combines the efficiency of infrared preheating with the uniformity of hot air preheating. For example, first use infrared radiation to quickly heat up the circuit board, and then use hot air to supplement the heating, making the temperature distribution more uniform and reducing energy consumption while ensuring welding quality.
Optimize peak height and speed
The peak height should be adjusted according to the thickness of the circuit board and the height of the components. In general, it is more appropriate to keep the distance between the top of the peak and the bottom of the circuit board between 0.5-1.5mm. Excessive wave peaks not only increase the oxidation of solder, but also consume more energy to maintain the flow of wave peaks. Appropriately reducing the peak height can reduce the contact area between solder and air, decrease the degree of oxidation, and reduce the power consumption of the pump.
The peak speed also needs to be reasonably controlled. For most circuit boards, the peak speed can be set between 1-1.5m/min. Excessive speed can lead to a decrease in the quality of solder joints, requiring re soldering and wasting energy; If the speed is too slow, it will prolong the welding time and increase energy consumption. By conducting experiments and practical operations, finding the optimal peak speed suitable for a specific circuit board can effectively improve soldering efficiency and energy saving.
Choose appropriate solder and flux
Choosing low melting point solder can lower the temperature of wave soldering, thereby saving energy. For example, in some temperature sensitive electronic product soldering, alloy solder such as Sn Cu Ni is used, which has a relatively low melting point and can achieve good soldering results at lower temperatures.
High quality soldering flux can improve welding quality and reduce welding defects. It can enhance the wettability of solder, make the welding process smoother, reduce the need for reprocessing due to poor welding, and indirectly achieve the goal of energy conservation. The active ingredients of soldering flux should be selected based on factors such as the cleanliness of the circuit board and the type of components.
